Bidding NO :4197-214BOECDPD01/84
Bidding Content:Bonding Machine
Bidding Agency:China Electronics Commerce (Beijing) Co., Ltd
Purchasers:Chengdu BOE Display Sci-tech Co., Ltd.
Open-Time of Bids:2025-03-21 10:00
Ending Date of Evaluation Result:2025-03-26 23:59
Who proposed the successful bidder:
| rank | Proposed Bid-winner | Manufacturer | Manufacturer Country |
|---|---|---|---|
| 1 | Shenzhen Semipeak Technology Co., Limited | Shenzhen Semipeak Technology Co., Limited | China |
